| 1. | Magnetron sputtering target source and sputtering procedure
磁控溅射靶源设计及溅射工艺研究 |
| 2. | Magnetron sputtering target plating machine
磁控平面靶镀膜机系列 |
| 3. | Standard specification for chromium sputtering targets for thin film applications
薄膜设备用铬喷镀极 |
| 4. | Standard test method for pass through flux of circular magnetic sputtering targets
圆形磁射极板磁力线通过量的标准试验方法 |
| 5. | Standard test method for pass through flux of circular magnetic sputtering targets , method 2
圆形磁性溅涂靶磁通量的标准试验方法2 |
| 6. | Standard specification for refractory silicide sputtering targets for microelectronic applications
微电子设备用耐熔硅化物溅射电极 |
| 7. | Standard specification for high purity titanium sputtering targets for electronic thin film applications
电子薄膜用高纯度钛溅射靶机的标准规范 |
| 8. | Aluminum alloy films and sputtering targets for semiconductor integrated circuit wiring and electrodes
集成电路电极布线用铝合金薄膜及其溅射靶材 |
| 9. | Standard practice for ultrasonic c - scan bond evaluation of sputtering target - backing plate assemblies
溅射目标垫板部件的超声波c扫描粘结评定标准规程 |
| 10. | We designed a new type of sputter target whose distribution structure made si no embedded in 8102 more homogeniously
我们的样品在t 。较低时，主要成分是a sicx的混合。随t 。 |
